PACK EXPO International puts Chicago front-and-centre of the packaging universe
October 15, 2018
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Since its inception way back in 1956, the biennial PACK EXPO International has created a reputation within the global packaging industry as being the biggest and most informative packaging event of the year.
And no doubt this reputation will continue its benchmarking way next month as PACK EXPO International 2018, along with the co-located Healthcare Packaging EXPO 2018, open their doors to both exhibitors and visitors from over 125 different countries, with its massive show floor full of machinery in action and packaging solutions as far as they eye can see.
Running Oct. 14-17 at Chicago’s grandiose McCormick Place fairgrounds, show producer PMMI – the association for packaging and processing technologies – is expecting more than 50,000 attendees from virtually every market in the packaging industry to network, discover new innovative ideas and benefit from fresh perspectives on current and emerging technologies.
With over 1.2 million net square feet, attendees will have no shortage of vendors to visit, with well over confirmed 2,500 exhibiting companies at press time eager to provide attendees with a clear vision and practical answers on how to make their packaging goals a reality.
As part of the event’s Partner Program, Healthcare Packaging EXPO will continue its run as the most comprehensive pharmaceutical show packaging and processing show in North America—showcasing a diverse range of equipment and technology solutions for pharmaceutical and medical device companies.
“The Association Partner Pavilions at PACK EXPO International, and co-located Healthcare Packaging EXPO, bring together leading industry associations with decision makers from the world’s top CPG (consumer packaged goods) companies, retailers and pharmaceutical, medical device and nutraceutical manufacturers,” says PMMI president and chief executive office Jim Pittas. “The expertise and industry knowledge provided by partner associations on-site offer an invaluable resource to attendees.”
With PACK EXPO often acting as a giant gathering platform for industry networking, there will be many market-specific partner associations hosting highly informative on-it pavilions, networking lounges and educational sessions to give the show visitors an unrivalled learning experience.
“One of the added benefits of attending the show is the opportunity to network and meet like-minded industry professionals,” says PMMI’s senior director of expositions Laura Thompson.
“Through these lounges, we are able to add value by connecting OEMs (original equipment manufacturer) and CPGs with those specifically in their markets. “We look forward to maintaining our established alliances with these premier industry associations in order to continue bringing the industry together and, ultimately, effecting growth in the packaging sector as a whole.”
As always, the show will offer the latest information on the fast-growing range of important trends and issue s impacting the international packaging community with the participation of leading international packaging industry groups such as Canada’s own PAC Packaging Consortium; ANSI (American National Standards Institute); CCTI (Composite Can and Tube Institute); FPA (Flexible Packaging Association); GCCA (Global Cold Chain Alliance); HCPC (Healthcare Compliance Packaging Council); IoPP (Institute of Packaging Professionals); PPA (Paperboard Packaging Alliance); OMAC (The Organization for Machine Automation and Control); UPA (United Packaging Associates); and WPO (World Packaging Organization).
“The IoPP is very excited once again to support PMMI’s PACK EXPO International, and Healthcare Packaging EXPO through the Partner Program,” says Jane Chase, executive director at IoPP.
“We look forward to our continued association with PMMI and PACK EXPO as we explore other ways we might help each other to better serve the packaging community.”
Every PACK EXPO International always has something new to offers to the attendees, and this year’s inaugural PACKage Printing Pavilion will be showcasing the latest advances digital printing technologies.
To be located in the South Hall, the specially-designated 50,000-square-foot area will feature all the prominent digital printing OEMs and their suppliers to deliver practical solution for addressing key end-user challenges such as SKU proliferation, micromarketing efforts, sustainability and traceability.
Specifically, the new Pavilion will place a heightened emphasis in its presentations regarding the advantages of digital printing, including short-run production, on-demand labeling, variable data collection and analysis, and personalized packaging.
Recent trends in the packaging industry have shown that consumers more than ever are seeking out more ‘smart’ packaging options, and the advancements made in digital printing have become a top-of-mind area of focus within the packaging industry at large.
“With the expected growth in digital package printing, we are thrilled to offer a space where end users seeking solutions can connect with the suppliers providing these new innovations,” says PMMI’s Thompson. “Attendees will find cutting-edge digital printing advancements all in one designated area allowing them to maximize their time at the show.”
The nearly sold out PACKage Printing Pavilion will comprise of several marketleading digital printing companies who will be showcasing their technologies and key observations moving forward in the industry, including: Afinia Label, Engineered Printing Solutions, Epson, Hanglory, HP Indigo, KAO Collins, Sappi, Schober, Swiftcolor, Xante, Quick Label Systems and KBA.
In addition to interacting with suppliers and exploring state-of-the-art technologies, attendees will also have the opportunity to take part in free 30-minute seminars taking place at one of the show’s several Innovation Stage locations, where some of the industry’s leading lights will be offering their well-informed insight on state of packaging today and well into the future.
For more details, go to www.packexpo.com.